NIST CNST - NanoCenter Collaboration Grant
photo courtesy HDR Architecture, Inc./Steve Hall
© Hedrich Blessing
In July of 2006, The National Institute of Standards and Technology (NIST) Center for Nanoscale Science and Technology
(CNST) awarded the University of Maryland a $1.5M Nanotechnology grant that supports a cooperative agreement to broaden
collaborations in research efforts in development and manufacturing at the nano scale.
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How to Use the CNST NanoFab Facilities
In order to use the CNST facilities, you must first discuss your projct with the NanoFab Manager (nanofab@nist.gov).
Details For NIST Staff or Guests Researchers:
For NIST Staff or Guest Researchers
Details For External Users:
For External "Facility Users"
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Travel Grant Award
The CNST in cooperation with the University of Maryland NanoCenter is offering opportunities for young researchers and graduate students to use the CNST facilities. The travel grant award covers costs of traveling beyond normal communting distances up to $1000.
For more information visit the CNST Travel Grant Page.
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CNST NanoFab Facilities
Click the category to view the list of equipment
- Specialty Tools
- Lithography
- Laser Pattern Generator: Heidelberg DWL-66FS
- E-beam Lithography System: Vistec VB300
- Nano-Imprint Lithography Tool: Nanonex NX-2000
- Nanonex Ultra-100: Integrated UV-Ozone Cleaner / Molecular Vapor Coater
- MA6 Front and Back Contact Aligner: Suss Microtec
- MA8 Front Side Contact Aligner: Suss Microtec
- Spinner: Laurell Technologies Series WS-400/500
- Spinner: Brewer Science CEE Model 100CB Spinner/Hotplate
- Post Process
- Wafer Dicing Saw-Disco Model 341
- Wire Bonder: Kulicke and Soffa Model 4526
- Critical Point Dryer
- Furnaces/CVD
- General Thermal Oxidation and Diffusion Furnace/Bank 2
- CMOS Thermal Oxidation and Diffusion Furnace/Bank 1
- Low Pressure Chemical Vapor Deposition (LPCVD) Furnace/Bank 3
- Rapid Thermal Annealer-Modular Process Technology
- PECVD-Unaxis 790
- Dry Etch
- Oxford Plasmalab 100 - etch III-V group and metals
- Oxford Plasmalab 100 - etch Si, SiO2 and SiN,x
- Deep RIE-Unaxis SHUTTLELINE DSEII
- Metal RIE-Unaxis 790
- Silicon RIE-Unaxis 790
- ICP Metal Etcher-Unaxis SHUTTLELINE ICP
- XeF2 Silicon Etch-Xactix Xetch e1 Series
- PVA Tepla 300 Microwave Plasma System
- Metal Deposition
- Wet Chemistry
- Heated Wet Chemical Bench: 6-ft
- Heated Wet Chemical Bench: 8-ft
- Spin Rinse Dryers: Semitool PSC-101
- Sputterer: Denton Discovery 22
- Inspection
- Stress Measurement Tool: Toho Technology FLX-2320
- Table-top SEM: Hitachi TM-1000
- Scanning Electron Microscope: Zeiss Ultra-60 FESEM
- Atomic Force Microscope: Veeco Dimension 3100
- Atomic Force Microscope: Digital Instruments/Veeco Dimension 3000
- Contact Angle Goniometer
- Spectroscopic Ellipsometer: Woollam XLS-100
- Nanospec Reflectometer: Nanometrics
- Contact Profilometer: Dektak 6M
- View the Complete Equipment List
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CNST Travel Grant Award
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