November 21, 2017 UMD Home NanoCenter AIMLab
Back to Equipment List EVG 620 Mask Aligner
Description Note: bulb changed 7-05-2016! Intensity is now 17 mw/cm2

Do NOT turn off after use, use SO use the new track ball and left button

The EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron. The EVG 620 is fitted with a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 01 Wafer Bonder.
Location FabLab | Photo Tunnel
Manufacturer EVG 620
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Discussion Link Lithography Discussion Page
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Tue, Nov 21, 2017
2:00 pm - 3:00 pm
Cameron Harner
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Tue, Nov 21, 2017
12:15 pm - 12:45 pm
Lara Skibbie
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Mon, Nov 20, 2017
12:15 pm - 1:00 pm
Cameron Harner
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Sun, Nov 19, 2017
10:45 am - 11:00 am
Mitchell Gross
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Fri, Nov 17, 2017
11:00 am - 11:30 am
Beibei Xu
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Records to show:
SOPs
620Bondalign.pdf (1.01 MB)
620Lithography.pdf (995.56 KB)
index.php (38 B)
photo-05_sop_EVG620_mask_aligner.pdf (86.36 KB)
Manuals

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