September 26, 2017 UMD Home NanoCenter AIMLab
Back to Equipment List EVG 620 Mask Aligner
Description Note: bulb changed 7-05-2016! Intensity is now 17 mw/cm2

Do NOT turn off after use, use SO use the new track ball and left button

The EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron. The EVG 620 is fitted with a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 01 Wafer Bonder.
Location FabLab | Photo Tunnel
Manufacturer EVG 620
Staff Contact JohnJohn Abrahams
Discussion Link Lithography Discussion Page
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Date Start End User
09/27/2017 12:00 PM 12:30 PM Cameron Harner

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Wed, Sep 27, 2017
12:00 pm - 12:30 pm
Cameron Harner
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Tue, Sep 26, 2017
12:00 pm - 1:00 pm
John Abrahams
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Testing AZ 4620
Mon, Sep 25, 2017
5:45 pm - 6:00 pm
Mary Doolin
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Mon, Sep 25, 2017
1:30 pm - 1:45 pm
Lara Skibbie
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Sun, Sep 24, 2017
3:00 pm - 3:30 pm
Lara Skibbie
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Records to show:
620Bondalign.pdf (1.01 MB)
620Lithography.pdf (995.56 KB)
index.php (38 B)
photo-05_sop_EVG620_mask_aligner.pdf (86.36 KB)

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