February 22, 2018 UMD Home NanoCenter AIMLab
Back to Equipment List EVG 620 Mask Aligner
Description Note: bulb changed 1-3-2018! Intensity is now 21 mw/cm2

Do NOT turn off after use, use SO use the new track ball and left button

The EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron. The EVG 620 is fitted with a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 01 Wafer Bonder.
Location FabLab | Photo Tunnel
Manufacturer EVG 620
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Discussion Link Lithography Discussion Page
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Wed, Feb 21, 2018
8:30 am - 8:45 am
Kelsey Gray
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Mon, Feb 19, 2018
5:00 pm - 6:00 pm
Crystal Hill
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Fri, Feb 16, 2018
9:00 am - 10:00 am
John Abrahams
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Thu, Feb 15, 2018
9:30 am - 9:45 am
Kelsey Gray
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Deleted by: Kelsey Gray

Thu, Feb 08, 2018
4:30 pm - 5:00 pm
Mary Doolin
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Records to show:
SOPs
620Bondalign.pdf (1.01 MB)
620Lithography.pdf (995.56 KB)
index.php (38 B)
photo-05_sop_EVG620_mask_aligner.pdf (86.36 KB)
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