June 21, 2018 UMD Home NanoCenter AIMLab
Back to Equipment List EVG 501 Bonder
Description The EVG 501 is used to bond 4" silicon wafers together using a combination of pressure and heat. Patterned wafers can be pre-aligned in the EVG 620 Mask Aligner using a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 501 Wafer Bonder. Once the wafers are aligned, the fixture is moved to the bonding station.
Location FabLab | Photo Tunnel
Manufacturer EVG 501
Staff Contact JonathanJonathan Hummel
301 405-5017
Discussion Link Lithography Discussion Page
Login Help
Reservations No upcoming reservations at this time.
Please login to make a reservation.
Tue, Jun 05, 2018
9:30 am - 1:00 pm
Michael Yeh
View Reservation
Thu, May 31, 2018
9:00 am - 11:30 am
Michael Yeh
View Reservation

Deleted by: Jonathan Hummel

Sat, Dec 05, 2015
9:30 am - 12:30 pm
Mei Zhan
View Reservation

Deleted by: Mei Zhan

Thu, Dec 03, 2015
9:30 am - 12:30 pm
Mei Zhan
View Reservation
Mon, Nov 23, 2015
10:00 am - 4:00 pm
Mei Zhan
View Reservation
Records to show:
index.php (38 B)
photo-06_bond_align.pdf (1.01 MB)
photo-06_sop_EVG_bonder.pdf (16.01 MB)

You must have reservation permissions to view the manuals. Please login to view manuals.


NanoCenter Group NanoCenter

Communicate Director: Jim O'Connor
Contact the Webmaster

Links Logos
Privacy Policy

Copyright The University of Maryland University of Maryland
2004-2018 Privacy Policy