November 21, 2017 UMD Home NanoCenter AIMLab
Back to Equipment List EVG 501 Bonder
Description The EVG 501 is used to bond 4" silicon wafers together using a combination of pressure and heat. Patterned wafers can be pre-aligned in the EVG 620 Mask Aligner using a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 501 Wafer Bonder. Once the wafers are aligned, the fixture is moved to the bonding station.
Location FabLab | Photo Tunnel
Manufacturer EVG 501
Staff Contact JonathanJonathan Hummel
jhummel1@umd.edu
301 405-5017
Discussion Link Lithography Discussion Page
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Sat, Dec 05, 2015
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Mei Zhan
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SOPs
index.php (38 B)
photo-06_bond_align.pdf (1.01 MB)
photo-06_sop_EVG_bonder.pdf (16.01 MB)
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