August 23, 2019 UMD Home NanoCenter AIMLab
Back to Equipment List EVG 501 Bonder
Description The EVG 501 is used to bond 4" silicon wafers together using a combination of pressure and heat. Patterned wafers can be pre-aligned in the EVG 620 Mask Aligner using a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 501 Wafer Bonder. Once the wafers are aligned, the fixture is moved to the bonding station.
Location FabLab | Photo Tunnel
Manufacturer EVG 501
Staff Contact JonathanJonathan Hummel
jhummel1@umd.edu
301 405-5017
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Logs
Mon, Jul 22, 2019
9:00 am - 12:00 pm
Jung Yeon Han
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Tue, Jun 04, 2019
10:00 am - 1:00 pm
Tilak Hewagama
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Thu, Jan 24, 2019
1:00 pm - 1:30 pm
Tilak Hewagama
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Tue, Oct 09, 2018
- 1:15 am
Michael Yeh
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Mon/Tuesday
Sat, Oct 06, 2018
5:00 am - 5:30 am
Michael Yeh
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Sat
Records to show:
SOPs
index.php (38 B)
photo-06_bond_align.pdf (1.01 MB)
photo-06_sop_EVG_bonder.pdf (16.01 MB)
Manuals

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