November 21, 2017 UMD Home NanoCenter AIMLab
Description The Strasbaugh 6EC Chemical Mechanical Polisher (CMP) is used to remove thin layers of SiO2 on silicon wafers for planarization of devices and circuits. It is located in the subfab and is only available to users approved by and trained by FabLab staff.
Location FabLab | Subfab
Manufacturer Strasbaugh 6EC
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Discussion Link Backside Discussion Page
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Tue, Mar 24, 2009
8:45 am - 9:00 am
Thao Nguyen
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training with Jon H.
Thu, Feb 19, 2009
7:30 pm - 8:30 pm
Aaron Gerratt
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Thu, Feb 19, 2009
1:30 pm - 4:00 pm
Aaron Gerratt
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Mon, Feb 09, 2009
2:00 pm - 7:00 pm
Aaron Gerratt
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Wed, Jan 28, 2009
1:45 pm - 6:30 pm
Aaron Gerratt
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cmp pdms/si
Records to show:
SOPs
bkside-01_sop.pdf (766.08 KB)
index.php (38 B)
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