September 26, 2017 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw A - Microautomation
Description This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Discussion Link Backside Discussion Page
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Reservations No upcoming reservations at this time.
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Logs
Wed, Sep 20, 2017
10:00 pm - 11:00 pm
Ivan Penskiy
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Fri, Sep 15, 2017
3:30 pm - 4:00 pm
YANGYI YAO
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Mon, Sep 11, 2017
12:15 pm - 1:15 pm
Michael Yeh
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Tue, Sep 05, 2017
4:45 pm - 5:15 pm
YANGYI YAO
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Tue, Sep 05, 2017
2:00 pm - 3:30 pm
Yiwen Hu
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Records to show:
SOPs
bkside-02_sop.doc (2.37 MB)
index.php (38 B)
Manuals

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Recipes

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