June 21, 2018 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw A - Microautomation
Description This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Discussion Link Backside Discussion Page
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Reservations No upcoming reservations at this time.
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Logs
Thu, Jun 21, 2018
2:30 pm - 3:00 pm
Shengjie Xie
View Reservation
Tue, Jun 19, 2018
10:00 am - 11:00 am
John Abrahams
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Deleted by: John Abrahams

Training Aaron Green
Tue, Jun 19, 2018
10:00 am - 10:00 am
John Abrahams
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Training Aaron Green
Mon, Jun 18, 2018
3:30 pm - 4:00 pm
YANGYI YAO
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Thu, Jun 14, 2018
9:00 am - 3:30 pm
Jacqueline Hines
View Reservation
R1024M3 dicing
Records to show:
SOPs
bkside-02_sop.doc (2.37 MB)
index.php (38 B)
Manuals

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Recipes

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