November 28, 2021 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw A - Microautomation
Description

Dicing saw has had PM done and is operational.

Note: If you need to coat with Photoresist you will need to reserve a spin station for at least 15 minutes,

If you are cleaning afterwards, reserve solvent bench for at least 15 minutes.

This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials.


For training on the saw, please contact John Abrahams @ 5-6664.


Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.

Location FabLab | Dicing Room
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Reservations No upcoming reservations at this time.
Please login to make a reservation.
Logs
Mon, Nov 22, 2021
12:00 pm - 12:45 pm
Ti Xie
View Reservation
Mon, Nov 22, 2021
10:00 am - 12:00 pm
Emma Huckestein
View Reservation
Tue, Nov 16, 2021
11:00 am - 12:00 pm
John Abrahams
View Reservation

Deleted by: John Abrahams

Training Dr. Coplan while dicing 6" Aluminum disk with Boron deposition
Tue, Nov 09, 2021
1:00 pm - 2:15 pm
Mitchell Gross
View Reservation
Fri, Nov 05, 2021
10:45 am - 12:00 pm
Sean O'Leary
View Reservation

Deleted by: Sean O'Leary

Records to show:
SOPs
bkside-02_sop.doc (2.37 MB)
index.php (38 B)
Manuals

You must have reservation permissions to view the manuals. Please login to view manuals.

Recipes

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