September 25, 2020 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw A - Microautomation
Description

This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials.


For training on the saw, please contact John Abrahams @ 5-6664.


Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.

Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Reservations No upcoming reservations at this time.
Please login to make a reservation.
Logs
Fri, Sep 25, 2020
10:00 am - 11:00 am
Michael Pedowitz
View Reservation
Abrahams-
Wed, Sep 23, 2020
9:45 am - 10:30 am
Shengjie Xie
View Reservation
Abrahams-
Fri, Sep 18, 2020
10:00 am - 4:00 pm
Jacqueline Hines
View Reservation
Abrahams-
Thu, Sep 17, 2020
12:00 pm - 1:00 pm
Sarit Zhukovsky
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Abrahams-
Tue, Sep 15, 2020
1:30 pm - 3:30 pm
Gang Li
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Abrahams-
Records to show:
SOPs
bkside-02_sop.doc (2.37 MB)
index.php (38 B)
Manuals

You must have reservation permissions to view the manuals. Please login to view manuals.

Recipes

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