November 21, 2017 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw A - Microautomation
Description This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Discussion Link Backside Discussion Page
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Reservations No upcoming reservations at this time.
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Logs
Tue, Nov 21, 2017
2:00 pm - 3:00 pm
Zhongjie Huang
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cut Si wafer
Tue, Nov 21, 2017
9:00 am - 9:30 am
John Abrahams
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Review for Jiahao
Tue, Nov 14, 2017
2:45 pm - 3:15 pm
YANGYI YAO
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Wed, Nov 08, 2017
10:45 am - 12:45 pm
Mitchell Gross
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Mon, Nov 06, 2017
4:00 pm - 5:00 pm
Mitchell Gross
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Records to show:
SOPs
bkside-02_sop.doc (2.37 MB)
index.php (38 B)
Manuals

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Recipes

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