February 22, 2018 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw A - Microautomation
Description This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
Discussion Link Backside Discussion Page
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Reservations No upcoming reservations at this time.
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Thu, Feb 22, 2018
8:00 am - 9:00 am
Kelsey Gray
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Tue, Feb 20, 2018
1:30 pm - 2:00 pm
John Abrahams
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Training Angelique
Thu, Feb 15, 2018
11:00 am - 12:00 pm
Kelsey Gray
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Deleted by: Kelsey Gray

Tue, Feb 13, 2018
10:00 am - 11:00 am
Andrew Lamont
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Dicing Si wafers
Wed, Feb 07, 2018
9:45 am - 10:30 am
Jonathan Larson
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Cutting devices for Alumina lithiation project
Records to show:
bkside-02_sop.doc (2.37 MB)
index.php (38 B)

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