September 26, 2017 UMD Home NanoCenter AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
tcl@umd.edu
301-405-3642
Discussion Link Etching Discussion Page
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Mon, Sep 25, 2017
1:00 pm - 2:00 pm
David Shahin
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Deleted by: David Shahin

Fri, Sep 22, 2017
4:30 pm - 5:00 pm
Rodney Snyder
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Tue, Sep 19, 2017
1:45 pm - 2:00 pm
Rodney Snyder
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Fri, Sep 15, 2017
1:15 pm - 1:45 pm
Christie Trimble
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Thu, Sep 14, 2017
5:45 pm - 6:00 pm
Christie Trimble
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SOPs
Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)
Manuals

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index.php (38 B)
Recipes

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