February 4, 2023 UMD Home NanoCenter AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
Reservations No upcoming reservations at this time.
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External Materials

If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring.

Wed, Feb 01, 2023
3:30 pm - 3:45 pm
Po-Chun Huang
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Wed, Feb 01, 2023
2:30 pm - 2:45 pm
Po-Chun Huang
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Wed, Feb 01, 2023
2:00 pm - 2:15 pm
Ryan Purcell
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Wed, Feb 01, 2023
1:45 pm - 2:00 pm
Po-Chun Huang
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Wed, Feb 01, 2023
1:00 pm - 1:15 pm
Po-Chun Huang
View Reservation
Records to show:
Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)

You must have reservation permissions to view the manuals. Please login to view manuals.


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