September 25, 2020 UMD Home NanoCenter AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
tcl@umd.edu
301-405-3642
Reservations No upcoming reservations at this time.
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Logs
Tue, Jun 30, 2020
12:30 pm - 2:00 pm
Nam Kim
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Deleted by: Jonathan Hummel

Mon, Jun 29, 2020
10:30 am - 12:00 pm
Nam Kim
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Deleted by: Jonathan Hummel

Wed, Jun 24, 2020
10:00 am - 11:00 am
Aysanew Abate
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Fri, Jun 19, 2020
10:45 am - 11:15 am
Uday Saha
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Fri, Jun 19, 2020
10:00 am - 10:30 am
Mitchell Gross
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Records to show:
SOPs
Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)
Manuals

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Recipes

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