December 1, 2021 UMD Home NanoCenter AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
Date Start End User
12/02/2021 09:00 AM 12:00 PM Thomas Loughran

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Thu, Dec 02, 2021
9:00 am - 12:00 pm
Thomas Loughran
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Wed, Dec 01, 2021
9:00 am - 11:00 am
Thomas Loughran
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Deleted by: Thomas Loughran

Tue, Nov 30, 2021
10:30 am - 12:00 pm
Mark Lecates
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Mon, Nov 29, 2021
1:00 pm - 1:15 pm
Deric Session
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Mon, Nov 29, 2021
11:15 am - 11:45 am
Mitchell Gross
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Records to show:
Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)

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