February 4, 2023 UMD Home NanoCenter AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
tcl@umd.edu
301-405-3642
Reservations No upcoming reservations at this time.
Please login to make a reservation.
External Materials

If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring.

Logs
Wed, Feb 01, 2023
3:30 pm - 3:45 pm
Po-Chun Huang
View Reservation
Wed, Feb 01, 2023
2:30 pm - 2:45 pm
Po-Chun Huang
View Reservation
Wed, Feb 01, 2023
2:00 pm - 2:15 pm
Ryan Purcell
View Reservation
Wed, Feb 01, 2023
1:45 pm - 2:00 pm
Po-Chun Huang
View Reservation
Wed, Feb 01, 2023
1:00 pm - 1:15 pm
Po-Chun Huang
View Reservation
Records to show:
SOPs
Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)
Manuals

You must have reservation permissions to view the manuals. Please login to view manuals.

Recipes

NanoCenter Group NanoCenter
FabLab
AIMLab

Communicate Director: John Abrahams
Contact the Webmaster

Links Logos
Privacy Policy
Sitemap

Copyright The University of Maryland University of Maryland
2004-2023 Privacy Policy
Sitemap