February 22, 2018 UMD Home NanoCenter AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
Discussion Link Etching Discussion Page
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Fri, Feb 23, 2018
1:15 pm - 5:00 pm
Nicholas Sharac
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Deleted by: Nicholas Sharac

Thu, Feb 22, 2018
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Mijin Kim
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Fri, Feb 16, 2018
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Thu, Feb 15, 2018
5:00 pm - 6:00 pm
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Thu, Feb 15, 2018
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Changmin Lee
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Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)

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index.php (38 B)

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