November 21, 2017 UMD Home NanoCenter AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
tcl@umd.edu
301-405-3642
Discussion Link Etching Discussion Page
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Logs
Tue, Nov 21, 2017
10:15 am - 11:00 am
Christie Trimble
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Tue, Nov 21, 2017
8:00 am - 12:00 pm
Zhouchen Luo
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Deleted by: Zhouchen Luo

Sat, Nov 18, 2017
2:45 pm - 3:00 pm
David Shahin
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Fri, Nov 17, 2017
6:15 pm - 6:30 pm
David Shahin
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Thu, Nov 16, 2017
2:00 pm - 3:00 pm
Aziz Karasahin
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SOPs
Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)
Manuals

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index.php (38 B)
Recipes

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