June 21, 2018 UMD Home NanoCenter AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
Discussion Link Etching Discussion Page
Login Help
Date Start End User
06/28/2018 10:30 AM 12:00 PM Mijin Kim

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Thu, Jun 28, 2018
10:30 am - 12:00 pm
Mijin Kim
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Wed, Jun 20, 2018
5:15 pm - 5:30 pm
Gang Li
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Wed, Jun 13, 2018
7:00 am - 7:30 am
Lunet Luna
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Tue, Jun 12, 2018
4:00 pm - 4:15 pm
Gang Li
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Thu, Jun 07, 2018
5:45 pm - 6:00 pm
Gang Li
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Records to show:
Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)

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index.php (38 B)

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