November 21, 2017 UMD Home NanoCenter AIMLab
Back to Equipment List Oxford PECVD
Description This Oxford Plasmalab System 100 is a Plasma Enhanced Chemical Vapor Deposition (PECVD) system. It is used to deposit low-stress thin films with excellent step coverage on a variety of samples at low temperatures (generally 200 - 300 O C). These thin films include:
  • SiO2 (both TEOS and SiH4-based)
  • SiNx
  • SiON
  • Α - Si
Location FabLab | CVD Tunnel
Manufacturer Oxford Instruments PlasmaLab System 100
Staff Contact ThomasThomas Loughran
Discussion Link Deposition Discussion Page
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Tue, Nov 21, 2017
1:30 pm - 4:00 pm
Shengjie Xie
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Yang Zhang
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Oxford PECVD SOP.pdf (709.05 KB)
index.php (38 B)

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