December 1, 2021 UMD Home NanoCenter AIMLab
Back to Equipment List Stress Measurement Tool
Description

The Flexus 2320 Stress Measurement Tool is used to measure stress in thin films. Silicon wafers are used as substrates for thin films. These films can be deposited by a variety of chemical vapor deposition, thermal or electron beam evaporation, sputtering or furnace growth. By optically measuring the change in the radius of curvature of the silicon substrate, both tensile and compressive stresses in thin films can be accurately determined.

This tool uses a laser. DO NOT LOOK DIRECTLY INTO THE LASER BEAM OR TRY TO DEFEAT ANY SAFETY INTERLOCKS. Do not attempt to change any calibration settings or laser alignment. Notify any FabLab staff member for help.

Location FabLab | Main Fab Hall
Manufacturer Flexus 2300
Staff Contact ThomasThomas Loughran
tcl@umd.edu
301-405-3642
Reservations No upcoming reservations at this time.
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Logs
Wed, Sep 22, 2021
11:15 am - 11:45 am
Paolo Lami
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Wed, Sep 22, 2021
9:30 am - 10:30 am
Abhay Andar
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Mon, Sep 20, 2021
11:00 am - 2:30 pm
Paolo Lami
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Thermal shock stress measurement
Thu, Sep 02, 2021
2:00 pm - 5:00 pm
Paolo Lami
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Thermal stress measurement
Mon, Aug 30, 2021
11:00 am - 11:30 am
Paolo Lami
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Single stress measurement
Records to show:
SOPs
index.php (38 B)
met-02_sop_stress_measurement_Flexus_2320.pdf (3.94 MB)
Manuals

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Recipes

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