August 23, 2019 UMD Home NanoCenter AIMLab
Back to Equipment List Critical Point Dryer
Description

The Supercritical Point Dryer anti-stiction release system increases both yield and uniformity of MEMS devices. Carbon dioxide is used as the transitional dry release fluid following wet etching steps. Auto-Process up to 5 - 4" wafers in less than 1 hour.

Location FabLab | ETCH Tunnel
Manufacturer
Staff Contact JonathanJonathan Hummel
jhummel1@umd.edu
301 405-5017
Reservations No upcoming reservations at this time.
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Logs
Wed, Aug 21, 2019
10:00 am - 11:30 am
Andrew Lamont
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Deleted by: Jonathan Hummel

Tue, Aug 20, 2019
10:00 am - 11:30 am
Andrew Lamont
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Fri, Aug 02, 2019
12:45 pm - 1:15 pm
Benjamin Barnes
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Fri, Aug 02, 2019
11:45 am - 12:30 pm
Benjamin Barnes
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Mon, Jul 22, 2019
4:00 pm - 4:30 pm
Keshav Rajasekaran
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Records to show:
SOPs
Etch -13 Supercritical Point Dryer SOP.pdf (1.88 MB)
index.php (38 B)
Manuals

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Recipes

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