December 1, 2021 UMD Home NanoCenter AIMLab
Back to Equipment List Critical Point Dryer
Description

The Supercritical Point Dryer anti-stiction release system increases both yield and uniformity of MEMS devices. Carbon dioxide is used as the transitional dry release fluid following wet etching steps. Auto-Process up to 5 - 4" wafers in less than 1 hour.

Location FabLab | ETCH Tunnel
Manufacturer
Staff Contact JonathanJonathan Hummel
jhummel1@umd.edu
301 405-5017
Reservations No upcoming reservations at this time.
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Logs
Thu, Nov 04, 2021
- 1:30 am
Sangyoon Kim
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Thu, Sep 09, 2021
7:00 am - 9:00 am
Benjamin Barnes
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Tue, Sep 07, 2021
1:00 pm - 2:00 pm
Harjot Singh
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Deleted by: Jonathan Hummel

Wed, Mar 31, 2021
11:30 am - 12:30 pm
Sangyoon Kim
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Thu, Mar 11, 2021
1:00 pm - 3:00 pm
Sangyoon Kim
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Records to show:
SOPs
Etch -13 Supercritical Point Dryer SOP.pdf (1.88 MB)
index.php (38 B)
Manuals

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Recipes

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