November 21, 2017 UMD Home NanoCenter AIMLab
Back to Equipment List Critical Point Dryer
Description

The Supercritical Point Dryer anti-stiction release system increases both yield and uniformity of MEMS devices. Carbon dioxide is used as the transitional dry release fluid following wet etching steps. Auto-Process up to 5 - 4" wafers in less than 1 hour.

Location FabLab | ETCH Tunnel
Manufacturer
Staff Contact JonathanJonathan Hummel
jhummel1@umd.edu
301 405-5017
Discussion Link Etching Discussion Page
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Logs
Thu, Sep 14, 2017
9:30 am - 11:00 am
Han Liu
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Mon, Jul 17, 2017
3:30 pm - 4:30 pm
Nikita Kedia
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Thu, Jul 13, 2017
1:30 pm - 2:30 pm
Nikita Kedia
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Thu, Jun 15, 2017
1:45 pm - 3:00 pm
Andrea Gilbert
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Drying spinach samples to prepare for SEM imaging
Thu, Jun 08, 2017
1:00 pm - 3:00 pm
Andrea Gilbert
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Records to show:
SOPs
Etch -13 Supercritical Point Dryer SOP.pdf (1.88 MB)
index.php (38 B)
Manuals

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index.php (38 B)
Recipes

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