January 18, 2020 UMD Home NanoCenter AIMLab
Back to Equipment List Critical Point Dryer
Description

The Supercritical Point Dryer anti-stiction release system increases both yield and uniformity of MEMS devices. Carbon dioxide is used as the transitional dry release fluid following wet etching steps. Auto-Process up to 5 - 4" wafers in less than 1 hour.

Location FabLab | ETCH Tunnel
Manufacturer
Staff Contact JonathanJonathan Hummel
jhummel1@umd.edu
301 405-5017
Reservations No upcoming reservations at this time.
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Logs
Tue, Jan 07, 2020
5:15 pm - 6:00 pm
Benjamin Barnes
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Thu, Nov 21, 2019
11:00 am - 12:00 pm
Chloe Keller
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Wed, Nov 06, 2019
11:15 am - 12:15 pm
Andrew Lamont
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PDMS-on-glass microchannel test
Sat, Oct 05, 2019
3:00 pm - 3:45 pm
Andrew Lamont
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Drying Pillars in Microfluidic Channels
Fri, Oct 04, 2019
1:00 pm - 2:00 pm
Andrew Lamont
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Drying pillars within microfluidic channel
Records to show:
SOPs
Etch -13 Supercritical Point Dryer SOP.pdf (1.88 MB)
index.php (38 B)
Manuals

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Recipes

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