November 21, 2017 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw B - Microautomation
Description Currently not in operation. This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Discussion Link Backside Discussion Page
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Reservations No upcoming reservations at this time.
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Logs
Tue, Nov 07, 2017
3:00 pm - 3:30 pm
George Banis
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Deleted by: George Banis

1 Si wafer, 1 glass wafer
Tue, Nov 07, 2017
3:00 pm - 3:30 pm
George Banis
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1 Si wafer and 1 glass wafer
Wed, Oct 25, 2017
3:15 pm - 3:45 pm
YANGYI YAO
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Thu, Sep 14, 2017
9:30 am - 11:45 am
John Abrahams
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Deleted by: John Abrahams

Fri, Sep 08, 2017
12:00 pm - 12:30 pm
John Abrahams
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Deleted by: John Abrahams

Records to show:
SOPs
bkside-03_sop.doc (2.37 MB)
index.php (38 B)
Manuals

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Recipes

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