September 26, 2017 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw B - Microautomation
Description Currently not in operation. This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
Discussion Link Backside Discussion Page
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Reservations No upcoming reservations at this time.
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Thu, Sep 14, 2017
9:30 am - 11:45 am
John Abrahams
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Deleted by: John Abrahams

Fri, Sep 08, 2017
12:00 pm - 12:30 pm
John Abrahams
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Deleted by: John Abrahams

Fri, Sep 01, 2017
12:45 pm - 1:45 pm
Jongbum Kim
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Tue, Aug 22, 2017
1:00 pm - 1:30 pm
George Banis
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500 micron thick glass wafer
Wed, Aug 02, 2017
4:30 pm - 5:30 pm
Sangwook Chu
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Deleted by: Sangwook Chu

Records to show:
bkside-03_sop.doc (2.37 MB)
index.php (38 B)

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