February 22, 2018 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw B - Microautomation
Description Currently not in operation. This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
Discussion Link Backside Discussion Page
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Reservations No upcoming reservations at this time.
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Fri, Jan 05, 2018
11:45 am - 1:45 pm
Jacqueline Hines
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Dicing C1016 M1
Thu, Dec 21, 2017
8:45 am - 2:30 pm
Jacqueline Hines
View Reservation
R1024 M1, M2 dicing
Tue, Dec 19, 2017
2:45 pm - 5:45 pm
Jacqueline Hines
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Deleted by: Jacqueline Hines

R1024M1 wafer dicing
Thu, Dec 14, 2017
10:45 am - 12:15 pm
Andrew Lamont
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Deleted by: Andrew Lamont

Dicing Si wafers
Tue, Nov 07, 2017
3:00 pm - 3:30 pm
George Banis
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Deleted by: George Banis

1 Si wafer, 1 glass wafer
Records to show:
bkside-03_sop.doc (2.37 MB)
index.php (38 B)

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