September 25, 2020 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw B - Microautomation
Description Currently not in operation. This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
Reservations No upcoming reservations at this time.
Please login to make a reservation.
Mon, Dec 03, 2018
12:30 pm - 2:45 pm
Jacqueline Hines
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C1021 M1 dicing
Fri, Nov 09, 2018
9:15 am - 4:45 pm
Jacqueline Hines
View Reservation
R1024M4 dicing Added 1.25 hours to cover cost of 2 saw blades
Wed, Oct 10, 2018
3:30 pm - 4:00 pm
Yiwen Hu
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Deleted by: Yiwen Hu

Tue, Sep 25, 2018
2:30 pm - 4:00 pm
Julia Sell
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Wed, Aug 29, 2018
3:00 pm - 3:15 pm
Blake Nuwayhid
View Reservation
Records to show:
bkside-03_sop.doc (2.37 MB)
index.php (38 B)

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