June 21, 2018 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw B - Microautomation
Description Currently not in operation. This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Discussion Link Backside Discussion Page
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Reservations No upcoming reservations at this time.
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Logs
Thu, Jun 14, 2018
9:15 am - 3:30 pm
Jacqueline Hines
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R1023M3 dicing
Thu, May 31, 2018
11:00 am - 11:15 am
YANGYI YAO
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Wed, May 23, 2018
11:30 am - 12:00 pm
YANGYI YAO
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Mon, Apr 09, 2018
10:30 am - 10:45 am
YANGYI YAO
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Wed, Apr 04, 2018
10:00 am - 12:30 pm
Qin Zeng
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Records to show:
SOPs
bkside-03_sop.doc (2.37 MB)
index.php (38 B)
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