April 19, 2024 UMD Home NanoCenter AIMLab
Back to Equipment List Oxford Etcher (Fluorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include: SF6-C4F8-CHF3-CF4-Ar-O2-He This etcher is used primarily for etching silicon and silicon oxides. The standard operating procedure and recipes for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact MarkMark Lecates
mlecates@umd.edu
301-405-5197
Rates
UMD
$81/hr
External Non-profit / University
$126/hr
Small Commercial / MTECH
$166/hr
Large Commercial
$242/hr
No Charge
$0/hr
Reservations No upcoming reservations at this time.
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External Materials

If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring.

Logs
Thu, Apr 18, 2024
9:30 am - 10:15 am
Maxwell Xuan
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Wed, Apr 17, 2024
5:15 pm - 6:30 pm
Leopoldo Tapia-Aracayo
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Dry Etch Tungsten Recipe
Tue, Apr 16, 2024
11:00 pm - 11:15 pm
Chengdao Yu
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Tue, Apr 16, 2024
5:30 pm - 6:00 pm
xiheng ai
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Tue, Apr 16, 2024
10:45 am - 11:30 am
Maxwell Xuan
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Records to show:
SOPs
Oxford Flourine Etcher SOP.pdf (252.38 KB)
index.php (38 B)
Manuals

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Recipes

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