ETCH-14: Oxford Etcher (Fluorine)

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Description

This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include: SF6-C4F8-CHF3-CF4-Ar-O2-He This etcher is used primarily for etching silicon and silicon oxides. The standard operating procedure and recipes for this tool is loaded into the PC that supports the ICP etcher.

Location

FabLab | ETCH Tunnel

Manufacturer

Oxford Instruments

Staff Contact

Mark Lecates
mlecates@umd.edu
301-405-5197

Reservations

Date	Start	End	User
12/02/2021	10:00 AM	11:00 AM	Mark Lecates

Please login to make a reservation.

Logs

	Thu, Dec 02, 2021 10:00 am - 11:00 am Mark Lecates View Reservation
	Tue, Nov 30, 2021 10:30 am - 11:00 am Michael Barrow View Reservation
	Mon, Nov 29, 2021 11:45 am - 12:00 pm Mitchell Gross View Reservation
	Tue, Nov 23, 2021 1:00 pm - 9:00 pm Mark Lecates View Reservation
	Tue, Nov 23, 2021 10:00 am - 10:30 am Joseph Brock View Reservation	Deleted by: Joseph Brock

SOPs

Oxford Flourine Etcher SOP.pdf (252.38 KB)

index.php (38 B)

Manuals

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Recipes