|Description||This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include: SF6-C4F8-CHF3-CF4-Ar-O2-He This etcher is used primarily for etching silicon and silicon oxides. The standard operating procedure and recipes for this tool is loaded into the PC that supports the ICP etcher.|
|Location||FabLab | ETCH Tunnel|
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