| Description |
This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher.
Gases plumbed to the system include:
SF6-C4F8-CHF3-CF4-Ar-O2-He
This etcher is used primarily for etching silicon and silicon oxides. The standard operating procedure and recipes for this tool is loaded into the PC that supports the ICP etcher. |
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| Location | FabLab |
ETCH Tunnel
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| Manufacturer |
Oxford Instruments |
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| Staff Contact |
 Mark Lecatesmlecates@umd.edu 301-405-5197 |
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| Logs |
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| SOPs |
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| Manuals
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| Recipes |
