November 28, 2021 UMD Home NanoCenter AIMLab
Description The Trion RIE is used to remove photoresist residue. Plumbed with O2,CF4,CHF3 and Sf6 the Etcher is an aggressive etcher for any organic material. Can be used to etch thin layers of SiO2 ,SiN and Si
Location FabLab | ETCH Tunnel
Manufacturer
Staff Contact MarkMark Lecates
mlecates@umd.edu
301-405-5197
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Tue, Nov 23, 2021
12:30 pm - 7:00 pm
Mark Lecates
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Tue, Nov 23, 2021
10:30 am - 11:00 am
Joseph Brock
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Deleted by: Joseph Brock

Tue, Nov 23, 2021
10:00 am - 11:00 am
Sungha Baek
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Tue, Nov 23, 2021
9:30 am - 10:00 am
Joseph Brock
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Mon, Nov 22, 2021
8:00 pm - 9:00 pm
Sungha Baek
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