May 21, 2022 UMD Home NanoCenter AIMLab
Description The Trion RIE is used to remove photoresist residue. Plumbed with O2,CF4,CHF3 and Sf6 the Etcher is an aggressive etcher for any organic material. Can be used to etch thin layers of SiO2 ,SiN and Si
Location FabLab | ETCH Tunnel
Manufacturer
Staff Contact MarkMark Lecates
mlecates@umd.edu
301-405-5197
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Fri, May 20, 2022
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Soaram Kim
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