March 21, 2018 UMD Home FabLab AIMLab
Description The STS Deep Reactive ion Etcher uses the Bosch process to cut deep, high aspect ratio channels in silicon. Used primarily for MEMs devices, the only materials permitted in this etcher are silicon wafers, photoresist and thin films of silicon dioxide and silicon nitride. All other materials are prohibited unless approved by FabLab staff.
Location FabLab | ETCH Tunnel
Manufacturer Surface Technology Systems
Staff Contact JonathanJonathan Hummel
301 405-5017
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
Please login to make a reservation.
Mon, Nov 13, 2017
7:15 am - 8:45 am
Akshaya Ganesh
View Reservation
Thu, Nov 09, 2017
9:00 am - 10:00 am
Akshaya Ganesh
View Reservation

Deleted by: Jonathan Hummel

Tue, Oct 31, 2017
10:00 am - 1:00 pm
Haotian Wang
View Reservation
Mon, Oct 30, 2017
9:00 am - 10:00 am
Haotian Wang
View Reservation

Deleted by: Jonathan Hummel

Tue, Oct 24, 2017
8:30 am - 10:30 am
Cameron Harner
View Reservation
Records to show:
Intro to Plasma Etching.pdf (512.1 KB)
etch-08_etch_rate_check.xls (40 KB)
etch-08_etch_rate_history.xls (40 KB)
etch-08_sop_STS_DRIE.pdf (3.62 MB)
index.php (38 B)

You must have lab permissions to view the manuals.

Please login to view manuals or contact the lab staff to obtain permissions.


STS Etching Recipes

Chamber Clean Procedure.doc (26 KB)
DRIEconditioningrecipe.pdf (182.54 KB)
STS reboot.doc (24.5 KB)

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

Communicate Contact Us
Contact the Webmaster
Follow us on TwitterTwitter logo

Links Privacy Policy

Copyright The University of Maryland University of Maryland