December 1, 2021 UMD Home FabLab AIMLab
Operational Status ‚óŹ Waiting for part/service
Description The STS Deep Reactive ion Etcher uses the Bosch process to cut deep, high aspect ratio channels in silicon. Used primarily for MEMs devices, the only materials permitted in this etcher are silicon wafers, photoresist and thin films of silicon dioxide and silicon nitride. All other materials are prohibited unless approved by FabLab staff.
Location FabLab | ETCH Tunnel
Manufacturer Surface Technology Systems
Staff Contact JonathanJonathan Hummel
301 405-5017
External Non-profit / University
Small Commercial / MTECH
Large Commercial
No Charge
Reservations No upcoming reservations at this time.
Wed, Dec 01, 2021
10:00 am - 2:00 pm
Harsimranjit Singh
View Reservation
Mon, Nov 22, 2021
12:15 pm - 1:45 pm
Harsimranjit Singh
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Fri, Nov 19, 2021
12:00 pm - 2:00 pm
Harsimranjit Singh
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Fri, Nov 12, 2021
1:00 pm -
Jonathan Hummel
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power outage until Monday 8 am.
Wed, Nov 10, 2021
9:30 am - 11:30 am
Abhay Andar
View Reservation
Records to show:
Intro to Plasma Etching.pdf (512.1 KB)
etch-08_etch_rate_check.xls (40 KB)
etch-08_etch_rate_history.xls (40 KB)
etch-08_sop_STS_DRIE.pdf (3.62 MB)
index.php (38 B)

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STS Etching Recipes

Chamber Clean Procedure.doc (26 KB)
DRIEconditioningrecipe.pdf (182.54 KB)
STS reboot.doc (24.5 KB)

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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