August 19, 2022 UMD Home FabLab AIMLab
Operational Status ‚óŹ Offline
Description The STS Deep Reactive ion Etcher uses the Bosch process to cut deep, high aspect ratio channels in silicon. Used primarily for MEMs devices, the only materials permitted in this etcher are silicon wafers, photoresist and thin films of silicon dioxide and silicon nitride. All other materials are prohibited unless approved by FabLab staff.
Location FabLab | ETCH Tunnel
Manufacturer Surface Technology Systems
Staff Contact JonathanJonathan Hummel
301 405-5017
External Non-profit / University
Small Commercial / MTECH
Large Commercial
No Charge
Reservations No upcoming reservations at this time.
Mon, May 16, 2022
1:30 pm - 2:30 pm
Harsimranjit Singh
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Wed, Apr 27, 2022
11:00 am - 1:30 pm
Sam Norris
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Deleted by: Jonathan Hummel

Tue, Apr 26, 2022
9:00 am - 1:00 pm
Jonathan Hummel
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chamber cleaning
Mon, Apr 25, 2022
4:00 pm - 5:00 pm
Haotian Wang
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Tue, Apr 19, 2022
2:00 pm - 2:30 pm
Haotian Wang
View Reservation

Deleted by: Haotian Wang

Records to show:
Intro to Plasma Etching.pdf (512.1 KB)
etch-08_etch_rate_check.xls (40 KB)
etch-08_etch_rate_history.xls (40 KB)
etch-08_sop_STS_DRIE.pdf (3.62 MB)
index.php (38 B)

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Please login to view manuals or contact the lab staff to obtain permissions.


STS Etching Recipes

Chamber Clean Procedure.doc (26 KB)
DRIEconditioningrecipe.pdf (182.54 KB)
STS reboot.doc (24.5 KB)

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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