March 18, 2018 UMD Home FabLab AIMLab
Back to Equipment List Oxford PECVD
Description This Oxford Plasmalab System 100 is a Plasma Enhanced Chemical Vapor Deposition (PECVD) system. It is used to deposit low-stress thin films with excellent step coverage on a variety of samples at low temperatures (generally 200 - 300 O C). These thin films include:
  • SiO2 (both TEOS and SiH4-based)
  • SiNx
  • SiON
  • Α - Si
Location FabLab | CVD Tunnel
Manufacturer Oxford Instruments PlasmaLab System 100
Staff Contact ThomasThomas Loughran
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
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Wed, Mar 14, 2018
5:00 pm - 6:00 pm
David Shahin
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Wed, Mar 14, 2018
4:00 pm - 5:00 pm
Kevin Palm
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Mon, Mar 12, 2018
11:00 am - 11:30 am
Weiwei Ping
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1.0 um of a-Silicon
Mon, Mar 12, 2018
10:00 am - 10:30 am
Kevin Palm
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Sun, Mar 11, 2018
4:15 pm - 6:15 pm
Kevin Palm
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Deleted by: Kevin Palm

Records to show:
Oxford PECVD SOP.pdf (709.05 KB)
index.php (38 B)

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