CVD-07: Oxford PECVD

June 25, 2018 UMD Home FabLab AIMLab

Description

This Oxford Plasmalab System 100 is a Plasma Enhanced Chemical Vapor Deposition (PECVD) system. It is used to deposit low-stress thin films with excellent step coverage on a variety of samples at low temperatures (generally 200 - 300 O C). These thin films include:

SiO2 (both TEOS and SiH4-based)
SiNx
SiON
Α - Si

Location

FabLab | CVD Tunnel

Manufacturer

Oxford Instruments PlasmaLab System 100
Link

Staff Contact

Thomas Loughran
tcl@umd.edu
301-405-3642

Rates

UMD

$71/hr

External Non-profit / University

$108/hr

Small Commercial / MTECH

$150/hr

Large Commercial

$200/hr

Reservations

Date	Start	End	User
06/28/2018	12:00 PM	01:30 PM	Mijin Kim

Logs

	Thu, Jun 28, 2018 12:00 pm - 1:30 pm Mijin Kim View Reservation
	Thu, Jun 21, 2018 11:00 am - 11:15 am Mitchell Gross View Reservation
	Tue, Jun 19, 2018 4:00 pm - 5:00 pm Lisa Krayer View Reservation	Deleted by: Lisa Krayer
	Tue, Jun 19, 2018 1:00 pm - 2:30 pm Boyang Liu View Reservation
	Tue, Jun 19, 2018 11:00 am - 1:00 pm Jiahao Zhan View Reservation

SOPs

Oxford PECVD SOP.pdf (709.05 KB)

index.php (38 B)

Manuals

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Please login to view manuals or contact the lab staff to obtain permissions.

Recipes

PECVD Recipes

High Quality SiON PECVD.tif (96.05 KB)
High Qulaity SiO2 PECVD.tif (78.22 KB)
SiNx PECVD.tif (102.04 KB)
TEOS based SiO2 PECVD.tif (100.2 KB)
a-Si PECVD.tif (74.76 KB)
a-Si_PECVD.txt (845 B)

CVD-07: Oxford PECVD

PECVD Recipes

Facilities Links