The Flexus 2320 Stress Measurement Tool is used to measure stress in thin films. Silicon wafers are used as substrates for thin films. These films can be deposited by a variety of chemical vapor deposition, thermal or electron beam evaporation, sputtering or furnace growth. By optically measuring the change in the radius of curvature of the silicon substrate, both tensile and compressive stresses in thin films can be accurately determined.

This tool uses a laser. DO NOT LOOK DIRECTLY INTO THE LASER BEAM OR TRY TO DEFEAT ANY SAFETY INTERLOCKS. Do not attempt to change any calibration settings or laser alignment. Notify any FabLab staff member for help.

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