Note: bulb changed 1-3-2018!
Intensity is now 21 mw/cm2
Do NOT turn off after use, use SO use the new track ball and left buttonThe EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron. The EVG 620 is fitted with a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 01 Wafer Bonder.
|Location||FabLab | Photo Tunnel|
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Photoresist ProcessesAZ4620_process.doc (25.5 KB)
NPR9 process.doc (24.5 KB)
NR9-1500PY.pdf (88.62 KB)
SPR220_resist_process.doc (25.5 KB)
baseline_shipley_1813_resist_chlorobenzene_lift.doc (28 KB)
chlorobenzene_lift.doc (28.5 KB)
photo_resist_pouring_procedure.doc (24 KB)
shipley_1813_positive_photolithography_process.doc (27 KB)