March 21, 2018 UMD Home FabLab AIMLab
Back to Equipment List EVG 620 Mask Aligner
Description Note: bulb changed 1-3-2018! Intensity is now 21 mw/cm2

Do NOT turn off after use, use SO use the new track ball and left button

The EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron. The EVG 620 is fitted with a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 01 Wafer Bonder.
Location FabLab | Photo Tunnel
Manufacturer EVG 620
Staff Contact JohnJohn Abrahams
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
Please login to make a reservation.
Tue, Mar 20, 2018
1:30 pm - 1:45 pm
Aysanew Abate
View Reservation
Thu, Mar 15, 2018
9:00 am - 11:00 am
Zhu Chen
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SU-8 photolithography
Sat, Mar 10, 2018
3:00 pm - 3:30 pm
Jung Yeon Han
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Mon, Mar 05, 2018
2:00 pm - 3:30 pm
John Abrahams
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Training Zhu Chen for SU-8
Mon, Mar 05, 2018
11:30 am - 11:45 am
Aysanew Abate
View Reservation
Records to show:
620Bondalign.pdf (1.01 MB)
620Lithography.pdf (995.56 KB)
index.php (38 B)
photo-05_sop_EVG620_mask_aligner.pdf (86.36 KB)

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