|Operational Status||● Online|
EVG- 620 is back in operation with a NEW power supply, new "Y" motion motor and PM.
Note: bulb changed 11-11-2020
Intensity is now 24 mw/cm2
Do NOT turn off after use, use SO use the new track ball and left button
The EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron.
The EVG 620 is fitted with a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 01 Wafer Bonder.Power supply
|Location||FabLab | Photo Tunnel|
External Non-profit / University
Small Commercial / MTECH
|Reservations||No upcoming reservations at this time.|
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Photoresist ProcessesAZ4620_process.doc (25.5 KB)
NPR9 process.doc (24.5 KB)
NR9-1500PY.pdf (88.62 KB)
SPR220_resist_process.doc (25.5 KB)
baseline_shipley_1813_resist_chlorobenzene_lift.doc (28 KB)
chlorobenzene_lift.doc (28.5 KB)
photo_resist_pouring_procedure.doc (24 KB)
shipley_1813_positive_photolithography_process.doc (27 KB)