December 13, 2018 UMD Home FabLab AIMLab
Back to Equipment List EVG 620 Mask Aligner
Description Note: bulb changed 1-3-2018! Intensity is now 21 mw/cm2

Do NOT turn off after use, use SO use the new track ball and left button

The EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron. The EVG 620 is fitted with a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 01 Wafer Bonder.
Location FabLab | Photo Tunnel
Manufacturer EVG 620
Staff Contact JohnJohn Abrahams
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
Wed, Dec 12, 2018
3:00 pm - 3:15 pm
Jung Yeon Han
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Wed, Dec 12, 2018
6:15 am - 6:30 am
Mitchell Gross
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Tue, Dec 11, 2018
1:00 pm - 2:00 pm
John Abrahams
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Training Pranav
Mon, Dec 10, 2018
12:45 pm - 1:00 pm
Aysanew Abate
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Fri, Dec 07, 2018
11:00 am - 12:00 pm
John Abrahams
View Reservation
Training Subhojit for 4" wafers
Records to show:
620Bondalign.pdf (1.01 MB)
620Lithography.pdf (995.56 KB)
index.php (38 B)
photo-05_sop_EVG620_mask_aligner.pdf (86.36 KB)

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