June 24, 2018 UMD Home FabLab AIMLab
Back to Equipment List EVG 620 Mask Aligner
Description Note: bulb changed 1-3-2018! Intensity is now 21 mw/cm2

Do NOT turn off after use, use SO use the new track ball and left button

The EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron. The EVG 620 is fitted with a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 01 Wafer Bonder.
Location FabLab | Photo Tunnel
Manufacturer EVG 620
Staff Contact JohnJohn Abrahams
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Date Start End User
06/25/2018 07:45 AM 08:30 AM Jonathan Vannucci
Mon, Jun 25, 2018
7:45 am - 8:30 am
Jonathan Vannucci
View Reservation
Fri, Jun 22, 2018
12:30 pm - 1:30 pm
John Abrahams
View Reservation

Deleted by: John Abrahams

Training Guy and Daniel.
Fri, Jun 22, 2018
12:00 pm - 12:30 pm
Jonathan Vannucci
View Reservation
Thu, Jun 21, 2018
5:00 pm - 5:15 pm
Christos Tengeris
View Reservation
Tue, Jun 19, 2018
11:30 am - 1:00 pm
George Banis
View Reservation
Records to show:
620Bondalign.pdf (1.01 MB)
620Lithography.pdf (995.56 KB)
index.php (38 B)
photo-05_sop_EVG620_mask_aligner.pdf (86.36 KB)

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