December 13, 2018 UMD Home FabLab AIMLab
Back to Equipment List EVG 620 Mask Aligner
Description Note: bulb changed 1-3-2018! Intensity is now 21 mw/cm2

Do NOT turn off after use, use SO use the new track ball and left button

The EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron. The EVG 620 is fitted with a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 01 Wafer Bonder.
Location FabLab | Photo Tunnel
Manufacturer EVG 620
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Rates
UMD
$71/hr
External Non-profit / University
$108/hr
Small Commercial / MTECH
$150/hr
Large Commercial
$200/hr
Reservations No upcoming reservations at this time.
Logs
Wed, Dec 12, 2018
3:00 pm - 3:15 pm
Jung Yeon Han
View Reservation
Wed, Dec 12, 2018
6:15 am - 6:30 am
Mitchell Gross
View Reservation
Tue, Dec 11, 2018
1:00 pm - 2:00 pm
John Abrahams
View Reservation
Training Pranav
Mon, Dec 10, 2018
12:45 pm - 1:00 pm
Aysanew Abate
View Reservation
Fri, Dec 07, 2018
11:00 am - 12:00 pm
John Abrahams
View Reservation
Training Subhojit for 4" wafers
Records to show:
SOPs
620Bondalign.pdf (1.01 MB)
620Lithography.pdf (995.56 KB)
index.php (38 B)
photo-05_sop_EVG620_mask_aligner.pdf (86.36 KB)
Manuals

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Recipes

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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