March 21, 2018 UMD Home FabLab AIMLab
Back to Equipment List EVG 501 Bonder
Description The EVG 501 is used to bond 4" silicon wafers together using a combination of pressure and heat. Patterned wafers can be pre-aligned in the EVG 620 Mask Aligner using a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 501 Wafer Bonder. Once the wafers are aligned, the fixture is moved to the bonding station.
Location FabLab | Photo Tunnel
Manufacturer EVG 501
Staff Contact JonathanJonathan Hummel
301 405-5017
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
Please login to make a reservation.
Sat, Dec 05, 2015
9:30 am - 12:30 pm
Mei Zhan
View Reservation

Deleted by: Mei Zhan

Thu, Dec 03, 2015
9:30 am - 12:30 pm
Mei Zhan
View Reservation
Mon, Nov 23, 2015
10:00 am - 4:00 pm
Mei Zhan
View Reservation
Fri, Nov 13, 2015
8:00 am - 11:30 am
Mei Zhan
View Reservation
Thu, Oct 15, 2015
9:00 am - 12:30 pm
David Deisenroth
View Reservation
Records to show:
index.php (38 B)
photo-06_bond_align.pdf (1.01 MB)
photo-06_sop_EVG_bonder.pdf (16.01 MB)

You must have lab permissions to view the manuals.

Please login to view manuals or contact the lab staff to obtain permissions.


Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

Communicate Contact Us
Contact the Webmaster
Follow us on TwitterTwitter logo

Links Privacy Policy

Copyright The University of Maryland University of Maryland