December 12, 2018 UMD Home FabLab AIMLab
Back to Equipment List EVG 501 Bonder
Description The EVG 501 is used to bond 4" silicon wafers together using a combination of pressure and heat. Patterned wafers can be pre-aligned in the EVG 620 Mask Aligner using a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 501 Wafer Bonder. Once the wafers are aligned, the fixture is moved to the bonding station.
Location FabLab | Photo Tunnel
Manufacturer EVG 501
Staff Contact JonathanJonathan Hummel
301 405-5017
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
Tue, Oct 09, 2018
- 1:15 am
Michael Yeh
View Reservation
Sat, Oct 06, 2018
5:00 am - 5:30 am
Michael Yeh
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Fri, Sep 28, 2018
8:00 pm - 9:00 pm
Michael Yeh
View Reservation
Mon, Sep 24, 2018
1:00 am - 1:30 am
Michael Yeh
View Reservation
Sun, Sep 23, 2018
7:00 pm - 8:00 pm
Michael Yeh
View Reservation
Records to show:
index.php (38 B)
photo-06_bond_align.pdf (1.01 MB)
photo-06_sop_EVG_bonder.pdf (16.01 MB)

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