Operational Status | ● Offline | |||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Description |
![]() |
|||||||||||||||
Location | FabLab |
Photo Tunnel
![]() |
|||||||||||||||
Manufacturer |
EVG 501 |
|||||||||||||||
Staff Contact |
![]() jhummel1@umd.edu 301 405-5017 |
|||||||||||||||
Rates | Large Commercial $220/hr Small Commercial / MTECH $158/hr External Non-profit / University $116/hr UMD $75/hr No Charge $0/hr |
|||||||||||||||
Reservations | No upcoming reservations at this time. | |||||||||||||||
Logs |
|
|||||||||||||||
SOPs |
|
|||||||||||||||
Manuals | You must have lab permissions to view the manuals. Please login to view manuals or contact the lab staff to obtain permissions. |
|||||||||||||||
Recipes | EVG Waver BondingBonder recipes.txt (3.99 KB)EVGSOP-1.pdf (570.57 KB) JOP030121 Anodic Bonding General Recipe.pdf (80.41 KB) JOP06027 Anodic Bonding Configuration.pdf (106.14 KB) JOP070214 Wafer rougness-cleaning-bond recipe spec.pdf (50.89 KB) SOP_EVG501_Sourav_12-14-03.pdf (723.03 KB) Triple-stack anodic bonding for MEMS applications_ECS Spring Meeting 2003.pdf (117.74 KB) Wafer Bonding Review.pdf (3.02 MB) |