December 1, 2021 UMD Home FabLab AIMLab
EVG 501 Bonder Back to Equipment List
Operational Status ‚óŹ Offline
Description The EVG 501 is used to bond 4" silicon wafers together using a combination of pressure and heat. Patterned wafers can be pre-aligned in the EVG 620 Mask Aligner using a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 501 Wafer Bonder. Once the wafers are aligned, the fixture is moved to the bonding station.
Location FabLab | Photo Tunnel
Manufacturer EVG 501
Staff Contact JonathanJonathan Hummel
301 405-5017
External Non-profit / University
Small Commercial / MTECH
Large Commercial
No Charge
Reservations No upcoming reservations at this time.
Mon, Jul 22, 2019
9:00 am - 12:00 pm
Jung Yeon Han
View Reservation
Tue, Jun 04, 2019
10:00 am - 1:00 pm
Tilak Hewagama
View Reservation
Thu, Jan 24, 2019
1:00 pm - 1:30 pm
Tilak Hewagama
View Reservation
Tue, Oct 09, 2018
- 1:15 am
Michael Yeh
View Reservation
Sat, Oct 06, 2018
5:00 am - 5:30 am
Michael Yeh
View Reservation
Records to show:
index.php (38 B)
photo-06_bond_align.pdf (1.01 MB)
photo-06_sop_EVG_bonder.pdf (16.01 MB)

You must have lab permissions to view the manuals.

Please login to view manuals or contact the lab staff to obtain permissions.


Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

Communicate Join Email List
Contact Us
Follow us on TwitterTwitter logo

Links Privacy Policy

Copyright The University of Maryland University of Maryland