|Operational Status||● Offline|
|Description||The EVG 501 is used to bond 4" silicon wafers together using a combination of pressure and heat. Patterned wafers can be pre-aligned in the EVG 620 Mask Aligner using a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 501 Wafer Bonder. Once the wafers are aligned, the fixture is moved to the bonding station.|
|Location||FabLab | Photo Tunnel|
External Non-profit / University
Small Commercial / MTECH
|Reservations||No upcoming reservations at this time.|
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EVG Waver BondingBonder recipes.txt (3.99 KB)
EVGSOP-1.pdf (570.57 KB)
JOP030121 Anodic Bonding General Recipe.pdf (80.41 KB)
JOP06027 Anodic Bonding Configuration.pdf (106.14 KB)
JOP070214 Wafer rougness-cleaning-bond recipe spec.pdf (50.89 KB)
SOP_EVG501_Sourav_12-14-03.pdf (723.03 KB)
Triple-stack anodic bonding for MEMS applications_ECS Spring Meeting 2003.pdf (117.74 KB)
Wafer Bonding Review.pdf (3.02 MB)