September 20, 2018 UMD Home FabLab AIMLab
Back to Equipment List Dicing Saw A - Microautomation
Description This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Rates
UMD
$25/hr
External Non-profit / University
$38/hr
Small Commercial / MTECH
$84/hr
Large Commercial
$124/hr
Reservations No upcoming reservations at this time.
Logs
Thu, Sep 13, 2018
1:30 pm - 1:45 pm
Jung Yeon Han
View Reservation
Wed, Sep 12, 2018
9:00 am - 10:00 am
John Abrahams
View Reservation
Training Sam and dicing Sapphire plus Silicon
Tue, Sep 11, 2018
2:00 pm - 2:30 pm
YANGYI YAO
View Reservation
Mon, Sep 10, 2018
2:30 pm - 2:45 pm
Jung Yeon Han
View Reservation
Sun, Sep 09, 2018
6:00 pm - 6:15 pm
Jung Yeon Han
View Reservation
Records to show:
SOPs
bkside-02_sop.doc (2.37 MB)
index.php (38 B)
Manuals

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Recipes

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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