|Description||This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.|
|Location||FabLab | Tool Prep Area|
External Non-profit / University
Small Commercial / MTECH
|Reservations||No upcoming reservations at this time.
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