July 9, 2020 UMD Home FabLab AIMLab
Back to Equipment List Dicing Saw A - Microautomation
Description

This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials.


For training on the saw, please contact John Abrahams @ 5-6664.


Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.

Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Rates
UMD
$25/hr
External Non-profit / University
$38/hr
Small Commercial / MTECH
$58/hr
Large Commercial
$124/hr
Reservations No upcoming reservations at this time.
Logs
Thu, Jun 25, 2020
1:00 pm - 2:00 pm
Xinjun wang
View Reservation
Abrahams- Xinjun Dicing LN
Mon, Jun 22, 2020
9:00 am - 1:00 pm
Jacqueline Hines
View Reservation
Abrahams- Dicing
Thu, Jun 18, 2020
10:45 am - 3:15 pm
Jacqueline Hines
View Reservation
Abrahams- Jackie dicing
Tue, Jun 09, 2020
10:00 am - 12:30 pm
Aysanew Abate
View Reservation
Reservation by John Abrahams for Aysanew with CoolCAD for Dicing wafers
Thu, Mar 19, 2020
11:00 am - 12:00 pm
John Abrahams
View Reservation
Zhongjie operating saw
Records to show:
SOPs
bkside-02_sop.doc (2.37 MB)
index.php (38 B)
Manuals

You must have lab permissions to view the manuals.

Please login to view manuals or contact the lab staff to obtain permissions.

Recipes

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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