August 19, 2022 UMD Home FabLab AIMLab
Dicing Saw A - Microautomation Back to Equipment List
Operational Status ‚óŹ Online

Dicing saw "A" is not always reliably operational. Water faults are intermittent and "STANDBY" button will allow a reset to start again.

Note: If you need to coat with Photoresist you will need to reserve a spin station for at least 15 minutes,

If you are cleaning afterwards, reserve solvent bench for at least 15 minutes.

This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials.

For training on the saw, please contact John Abrahams @ 5-6664.

Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.

Location FabLab | Dicing Room
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
External Non-profit / University
Small Commercial / MTECH
Large Commercial
No Charge
Reservations No upcoming reservations at this time.
Wed, Aug 17, 2022
10:00 am - 1:00 pm
Daniel Lewis
View Reservation
Mon, Aug 08, 2022
9:30 pm - 10:00 pm
Yang Zhang
View Reservation
Thu, Aug 04, 2022
6:00 pm - 6:30 pm
Haotian Wang
View Reservation
Wed, Aug 03, 2022
2:00 pm - 3:00 pm
Seungyeop Lee
View Reservation

Deleted by: John Abrahams

Training using Si wafer into 2x2 cm
Tue, Aug 02, 2022
10:00 am - 11:00 am
Oded Rabin
View Reservation
Dicing 12x12mm sample to 8x7mm
Records to show:
bkside-02_sop.doc (2.37 MB)
index.php (38 B)

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Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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