March 23, 2018 UMD Home FabLab AIMLab
Back to Equipment List Dicing Saw A - Microautomation
Description This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
Please login to make a reservation.
Mon, Mar 12, 2018
1:00 pm - 1:30 pm
Nadine Acuna
View Reservation
Fri, Mar 09, 2018
1:15 pm - 1:30 pm
John Abrahams
View Reservation
Dicing quarter wafer for bonding
Thu, Mar 08, 2018
2:30 pm - 3:30 pm
John Abrahams
View Reservation
Dicing training for Kedar Manandhar
Tue, Mar 06, 2018
5:30 pm - 6:00 pm
Sangwook Chu
View Reservation
Thu, Mar 01, 2018
1:00 pm - 2:00 pm
John Abrahams
View Reservation
Dicing for Angelique
Records to show:
bkside-02_sop.doc (2.37 MB)
index.php (38 B)

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