December 1, 2021 UMD Home FabLab AIMLab
Dicing Saw A - Microautomation Back to Equipment List
Operational Status ‚óŹ Online

Dicing saw has had PM done and is operational.

Note: If you need to coat with Photoresist you will need to reserve a spin station for at least 15 minutes,

If you are cleaning afterwards, reserve solvent bench for at least 15 minutes.

This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials.

For training on the saw, please contact John Abrahams @ 5-6664.

Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.

Location FabLab | Dicing Room
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
External Non-profit / University
Small Commercial / MTECH
Large Commercial
No Charge
Date Start End User
12/02/2021 10:30 AM 11:30 AM Michael Coplan
Thu, Dec 02, 2021
10:30 am - 11:30 am
Michael Coplan
View Reservation
Dicing wafer and training
Wed, Dec 01, 2021
1:45 pm - 2:15 pm
Sean O'Leary
View Reservation
Tue, Nov 30, 2021
11:30 am - 12:45 pm
Sarit Zhukovsky
View Reservation
Mon, Nov 29, 2021
1:00 pm - 2:00 pm
Sheron Lian
View Reservation
Mon, Nov 22, 2021
12:00 pm - 12:45 pm
Ti Xie
View Reservation
Records to show:
bkside-02_sop.doc (2.37 MB)
index.php (38 B)

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Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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