December 9, 2018 UMD Home FabLab AIMLab
Back to Equipment List Critical Point Dryer
Description

The Supercritical Point Dryer anti-stiction release system increases both yield and uniformity of MEMS devices. Carbon dioxide is used as the transitional dry release fluid following wet etching steps. Auto-Process up to 5 - 4" wafers in less than 1 hour.

Location FabLab | ETCH Tunnel
Manufacturer
Staff Contact JonathanJonathan Hummel
jhummel1@umd.edu
301 405-5017
Rates
UMD
$71/hr
External Non-profit / University
$108/hr
Small Commercial / MTECH
$150/hr
Large Commercial
$200/hr
Reservations No upcoming reservations at this time.
Logs
Wed, Dec 05, 2018
2:45 pm - 3:45 pm
Fan Yu
View Reservation
Dry
Wed, Nov 21, 2018
11:30 am - 12:15 pm
Sandesh Kalantre
View Reservation
Drying of SOI cantilever
Wed, Nov 21, 2018
10:30 am - 11:15 am
Sandesh Kalantre
View Reservation
Thu, Mar 01, 2018
12:45 pm - 1:45 pm
Nikita Kedia
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Wed, Feb 28, 2018
1:00 pm - 2:00 pm
Nikita Kedia
View Reservation

Deleted by: Thomas Loughran

Records to show:
SOPs
Etch -13 Supercritical Point Dryer SOP.pdf (1.88 MB)
index.php (38 B)
Manuals

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Recipes

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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