The Supercritical Point Dryer anti-stiction release system increases both yield and uniformity of MEMS devices. Carbon dioxide is used as the transitional dry release fluid following wet etching steps. Auto-Process up to 5 - 4" wafers in less than 1 hour.
|Location||FabLab | ETCH Tunnel|
External Non-profit / University
Small Commercial / MTECH
|Reservations||No upcoming reservations at this time.|
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