September 21, 2018 UMD Home FabLab AIMLab
Back to Equipment List Dicing Saw B - Microautomation
Description Currently not in operation. This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Rates
UMD
$25/hr
External Non-profit / University
$38/hr
Small Commercial / MTECH
$84/hr
Large Commercial
$124/hr
Reservations No upcoming reservations at this time.
Logs
Wed, Aug 29, 2018
3:00 pm - 3:15 pm
Blake Nuwayhid
View Reservation
Si
Mon, Jul 09, 2018
2:30 pm - 3:00 pm
George Banis
View Reservation
500 um thick 4 inch glass wafer with Cr/Au electrodes on top, protected with dicing tape.
Thu, Jun 14, 2018
9:15 am - 3:30 pm
Jacqueline Hines
View Reservation
R1023M3 dicing
Thu, May 31, 2018
11:00 am - 11:15 am
YANGYI YAO
View Reservation
Wed, May 23, 2018
11:30 am - 12:00 pm
YANGYI YAO
View Reservation
Records to show:
SOPs
bkside-03_sop.doc (2.37 MB)
index.php (38 B)
Manuals

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Recipes

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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