March 21, 2018 UMD Home FabLab AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
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Fri, Mar 09, 2018
10:45 am - 11:30 am
Mark Lecates
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Fri, Mar 09, 2018
9:00 am - 9:15 am
Lara Skibbie
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Thu, Mar 08, 2018
7:30 am - 12:00 pm
Lunet Luna
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Wed, Mar 07, 2018
1:00 pm - 1:15 pm
Lara Skibbie
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Wed, Mar 07, 2018
12:00 pm - 12:15 pm
David Shahin
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Records to show:
Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)

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