ETCH-07: Oxford ICP Etcher(Chlorine)

June 24, 2018 UMD Home FabLab AIMLab

Back to Equipment List Oxford ICP Etcher(Chlorine)

Description

This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:

Cl2, O2
SiCl4, SF6
CH4, Ar
H2, N2

This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.

Location

FabLab | ETCH Tunnel

Manufacturer

Oxford Instruments

Staff Contact

Thomas Loughran
tcl@umd.edu
301-405-3642

Rates

UMD

$71/hr

External Non-profit / University

$108/hr

Small Commercial / MTECH

$150/hr

Large Commercial

$200/hr

Reservations

Date	Start	End	User
06/26/2018	10:30 AM	12:30 PM	Mijin Kim
06/28/2018	10:30 AM	12:00 PM	Mijin Kim

Logs

	Thu, Jun 28, 2018 10:30 am - 12:00 pm Mijin Kim View Reservation
	Tue, Jun 26, 2018 10:30 am - 12:30 pm Mijin Kim View Reservation
	Wed, Jun 20, 2018 5:15 pm - 5:30 pm Gang Li View Reservation
	Wed, Jun 13, 2018 7:00 am - 7:30 am Lunet Luna View Reservation
	Tue, Jun 12, 2018 4:00 pm - 4:15 pm Gang Li View Reservation

SOPs

Oxford Chlorine Etcher SOP.pdf (384 KB)

index.php (38 B)

Manuals

You must have lab permissions to view the manuals.

Please login to view manuals or contact the lab staff to obtain permissions.

Recipes

Oxford Etch Recipes

AL2O3ICP180_BCl3-HBr.doc (48 KB)
AlGaN_GaN Etch Recipe.tif (225.63 KB)
GaAs_AlGaAs Etch Recipe.tif (277.68 KB)
InP Etch Recipe.tif (223.57 KB)
MgO Etch Recipe.doc (27.5 KB)

ETCH-07: Oxford ICP Etcher(Chlorine)

Oxford Etch Recipes

Facilities Links