March 21, 2018 UMD Home FabLab AIMLab
Back to Equipment List Oxford Etcher (Fluorine)

This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher.

    Gases plumbed to the system include:
  • SF6
  • C4F8
  • CHF3
  • CF4
  • N2
  • O2

This etcher is used primarily for etching silicon and silicon oxides. The standard operating procedure and recipes for this tool is loaded into the PC that supports the ICP etcher.

Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact MarkMark Lecates
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
Please login to make a reservation.
Thu, Mar 15, 2018
9:15 am - 9:45 am
Evan Yamaguchi
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Deleted by: Mark Lecates

Fri, Mar 09, 2018
3:30 pm - 4:00 pm
Evan Yamaguchi
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Fri, Mar 09, 2018
12:30 pm - 1:00 pm
Samuel Deitemyer
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I plan to etch bare silicon for 60 sec. I have schedualed more time than I will need becasue this is my second time operating this etcher.
Fri, Mar 09, 2018
11:00 am - 1:00 pm
Mark Lecates
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Deleted by: Mark Lecates

Fri, Mar 09, 2018
10:30 am - 10:45 am
Aysanew Abate
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Records to show:
Oxford Flourine Etcher SOP.pdf (252.38 KB)
index.php (38 B)

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