|Description||The Karl Suss MA-4 Mask Aligner is used with substrates up to 4" (100mm) in diameter. It also works for smaller samples. It is a contact/proximity aligner and can be set to utilize either 365 nm or 405 nm light. It is used with a variety of both positive and negative photoresists. Recipes for our standard photoresist processing are attached to the back of the operating instructions below. This system also offers real-time infrared through-wafer backside alignment.|
|Location||FabLab | Photo Tunnel|
Karl Suss MA-4
External Non-profit / University
Small Commercial / MTECH
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Photoresist ProcessesAZ4620_process.doc (25.5 KB)
NPR9 process.doc (24.5 KB)
NR9-1500PY.pdf (88.62 KB)
SPR220_resist_process.doc (25.5 KB)
baseline_shipley_1813_resist_chlorobenzene_lift.doc (28 KB)
chlorobenzene_lift.doc (28.5 KB)
photo_resist_pouring_procedure.doc (24 KB)
shipley_1813_positive_photolithography_process.doc (27 KB)